Precise automatic placement of SMD components. We handle fine pitch,QFP, SOIC and TSOP. Placement from tape, feeder and tray.
Precise soldering of THT components without damaging surrounding SMD components. Ultrasonic nozzle cleaning, adjustable flux, convection preheating. Suitable for mixed DPS (SMT + THT).
The oxygen-free inline process prevents oxidation — no overheating, uniform temperature across the entirDPSe range. Processes boards up to 600 × 500 mm. Full support for lead-free processes. Ideal forBGAs,QFPs, flip-chips and ceramic assemblies.
Manual and wave soldering of through-hole components. Suitable for connectors, transformers, relays and other THT components.
Soldering under a microscope, paste application, manual painting DPS. Commissioning and configuration DPS in accordance with the customer’s documentation. Functional verification and testing of the finished assembly.
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